Cyient DLM Limited started in 1993 and focuses on providing Electronic Manufacturing Services (EMS) and solutions. They offer various Electronic Manufacturing Services, such as Build to Print (B2P) and Build to Specification (B2S) solutions. With B2P services, clients provide the product design, and Cyient DLM handles the manufacturing in a flexible and agile way. On the other hand, B2S services involve designing the product based on client requirements and taking care of the manufacturing process.
IPO Date: Jun 27, 2023 to Jun 30, 2023 Price: ₹250 to ₹265 per share Lot Size: 56 Shares Issue Size: ₹592 Cr Fresh Issue: ₹592 Cr Issue Type: Book Built Issue IPO Listing At: NSE BSE
Opening Date: June 27, 2023 Closing Date: June 30, 2023 Basis of Allotment: July 05, 2023 Initiation of Refunds: July 06, 2023 Credit of Shares to Demat: July 07, 2023 Listing Date: July 10, 2023 10.00 A.M. to 5.00 p.m. Upto which mandate can be applied
Application Lots Shares Amount Retail (Min): 1 56 ₹14,840 Retail (Max): 13 728 ₹192,920 S-HNI (Min): 14 784 ₹207,760 Retail (Max): 67 3752 ₹994,280 S-HNI (Min): 68 3808 ₹1,009,120
Pre Issue Share Holding: 92.84% Post Issue Share Holding: 66.68%
Earning Per Share (EPS): ₹7.75 per Equity Share P/E Ratio: 66.25 Return on Net Worth (RoNW): 16.03% Net Asset Value (NAV): ₹31.34 Price/BV Ratio: Coming Soon
Market Cap (₹ Cr.): 2102 P/E Ratio: 66.25 Return on Equity (ROE) (%): 23.10 Return on Capital Employed (ROCE) (%): 13.48 Debt/Equity: Coming Soon
Note: The P/E ratio has been computed by dividing Issue Price with EPS